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Sony IMX560-AAMV SPAD ToF Depth Sensor

Enable long-range LiDAR with the Sony IMX560-AAMV SPAD ToF sensor, offering 3D imaging up to 300 m with advanced echo and ambient light suppression.

Sony IMX560-AAMV SPAD ToF Depth Sensor

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This component is now available through our sister company, RESTAR FRAMOS. For a production-ready alternative, explore our compatible integrated modules.

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Product Summary

High-range SPAD ToF sensor enabling precise 3D depth measurement up to 300 meters for LiDAR applications.

The Sony IMX560-AAMV is a cutting-edge SPAD (Single Photon Avalanche Diode) Time-of-Flight depth sensor optimized for high-resolution 3D distance measurement in industrial and FA LiDAR applications. Featuring a diagonal 6.25 mm (Type 1/2.9) sensor format with a 597 × 168 SPAD array, it supports adjustable macro pixel sizing for customizable range accuracy. The sensor enables depth capture up to 300 meters using 1 GHz sampling, delivering exceptional accuracy through advanced histogram-based ranging with 2024 time bins and 12-bit grayscale output. It incorporates echo and peak detection, ambient light suppression, and light emission timing control for robust performance in varying light conditions. Designed for real-time LiDAR mapping and obstacle detection, this sensor enhances the functionality of robotic systems, automated vehicles, and smart infrastructure. Its integrated DSP and signal processing make it a complete ToF solution for high-dynamic-range depth imaging.

Sony IMX560-AAMV SPAD ToF Depth Sensor Highlights

  • 597 × 168 SPAD array
  • Time-of-Flight depth up to 300m
  • Echo and ambient light suppression
  • Built-in histogram and DSP processing

Targeted Applications

  • Industrial LiDAR cameras
  • FA depth-sensing systems
  • Autonomous navigation
  • Smart infrastructure mapping

Product Specifications

Frame Rate [fps]Frame Rate [fps]
100
Horizontal Resolution [px]Horizontal Resolution [px]
597
Image Diagonal [mm]Image Diagonal [mm]
6.25
InterfaceInterface
MIPI CSI-2
ManufacturerManufacturer
Sony
PackagePackage
BGA
Pins / BallsPins / Balls
152
Pixel Size [µm]Pixel Size [µm]
Pixel Size y [µm]
Product TypeProduct Type
Area Sensors
Resolution [MP]Resolution [MP]
0.1
Sensor TypeSensor Type
CMOS
Target ApplicationTarget Application
FA LiDAR cameras, Industrial LiDAR cameras
Vertical Resolution [px]Vertical Resolution [px]
168

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