HSF150 Flexible Interposer Cable

Name: HSF150 Flexible Interposer Cable - FRAMOS
SKU: 22275
Availability: InStock

Flexible and durable interposer cable for Intel® RealSense™ modules.

Product Number: 22275

Category: 3D Accessories

Request a Quote for:

HSF150 Flexible Interposer Cable

Submit Your Details

Complete the quote request form with your project requirements and contact information.
Discuss Your Needs

Our specialists will reach out for a brief consultation to ensure we tailor the perfect imaging solution for your application.
Receive Your Custom Quote

We’ll provide a detailed quotation and guide you through the next steps, including evaluation kits, pricing, and timelines.

"*" indicates required fields

URL

This field is for validation purposes and should be left unchanged.

First Name*

Last Name*

Company*

Email*

Job Title

Country*

Phone*

Application*

Inquiry for product:*

Do you have a project in plan?

Your Comments/Questions*

Product Base:

HSF50 Flexible Interposer Cable

Other Variants:

Click the button to compare these products.

Product Summary

150mm flexible interposer cable for Intel® RealSense™.

HSF150 Flexible Interposer Cable Highlights

150mm length
360° flexibility
Ipex™ NOVASTACK® connector
5mm bend radius
Temperature rated -40°C to 105°C

Targeted Applications

Embedded Vision
Sensor Integration
Robotics

Product Specifications

Cable Length [m]: 0.05, 0.1, 0.15, 0.2
Product Type: Interposer Cable

Product Downloads

Documents

No documents are available at the moment.

Accessories

RealSense™ Depth Module D410

Manufacturer's Part #: 951913, Camera Module, 1920 x 1080, Rolling shutter, Baseline: 55 mm, USB interface, 50-pin Board-to-Board connector

RealSense™ Depth Module D415

Manufacturer's Part #: 952000, Camera Module, 1920 x 1080, Rolling shutter, FOV: 69.4° x 42.5° x 77°, Baseline: 55 mm, USB interface, 50-pin Board-to-Board connector

RealSense™ Depth Module D420

Manufacturer's Part #: 956826, Camera Module, 1280 x 800, Global shutter, FOV: 91.2° x 65.5° x 100.6°, Baseline: 50 mm, USB interface, 50-pin Board-to-Board connector

RealSense™ Depth Module D430

Manufacturer's Part #: 954010, Camera Module, 1280 x 800, Global shutter, FOV: 91.2° x 65.5° x 100.6°, Baseline: 50 mm, USB interface, 50-pin Board-to-Board connector

The HSF150 is a 150mm flexible interposer cable designed to connect Intel® RealSense™ modules with Intel® D4 processor boards. The cable's flexible PCB construction allows for a 360° bend in any direction, enabling versatile board configurations. It features an Ipex™ NOVASTACK® connector, is rated for temperatures between -40°C and 105°C, and supports a 5mm minimum bend radius. The HSF150 also complies with RoHS, WEEE, and SVHC standards, offering reliable performance in challenging environments and various embedded applications.

Our latest blogs

Welcome to our blog section, where knowledge meets inspiration. Explore insightful articles, expert tips, and the latest trends in our field.

View All

What Defines Good Image Quality?

Human eye vs. Machine Perception Image quality definition depends on the application. For the human eye, sharpness, brightness, color accuracy, minimal noise, and low optical distortion define a “good” image....

Pushing the Limits of Large-Format Imaging

Sony’s large-format sensor portfolio Sony has developed a broad lineup of large-format CMOS sensors that serve industrial, scientific, and observational applications. The rolling shutter family includes the IMX455 (61 MP),...

SLVS-EC: The High-Speed Interface for Next-Generation Vision

Rising Bandwidth Needs As imaging systems push toward higher resolutions and faster frame rates, traditional interfaces such as MIPI D-PHY and sub-LVDS often cannot keep up with the growing data...

FRAMOS Sensor Modules for Data-Driven Sports Analytics

Transforming Sports Analytics with ImagingThe use of image sensors has become increasingly important in sports analytics, revolutionizing the way player performance, team strategies, and game dynamics are understood. Modern sensors...

De-risking your large format sensor project from the get-go

Designing in large-format sensors is challenging: Board design and production processes need to be aligned and tuned in every batch to prevent deformation and unstable optical performance, tuning of multiple...

The Future of Edge AI Vision: Real-Time Intelligence at the Source

In 2026, we will experience a turning point in the combination of artificial intelligence and computer vision. The processing of image data “at the edge” is on the rise, adding...

Image sensors for agriculture: Innovations and Challenges

Precision farming in the digital age The use of image sensors has become increasingly important in agriculture in recent years, particularly in the context of precision farming. This development has...

Challenges and system considerations in 8K imaging

The transition to an 8K imaging system involves far more challenges than simply increasing the number of pixels. 8K typically means a horizontal resolution of around 7680 pixels at up...

Latest Article

Latest News

Search for products and other content