First sensor module for high-resolution image sensor IMX811 (247 MP) available soon

Embedded vision engineers and tech leads can start preparing for high-resolution applications.

The first on the market for engineers and tech leads in the embedded vision sector: FRAMOS will soon release the first image sensor module and development kit available on the market for Sony’s new high-resolution IMX811 image sensor with 247 megapixels.

This set comprises hardware, documentation, and a validated reference design supporting AMD’s development board. The system enables image streaming via SLVS-EC 3.0 and HDMI display output, simplifying the bring-up process for customers and offering a faster path to system prototyping. Embedded engineers will benefit from early access and will be able to implement innovative applications that were previously impossible or only feasible under difficult conditions.

In addition detailed inspections of products such as wafers, stitching applications can now also be built with just one sensor. The first FSM:IMX811 units are expected to be available in August.

“The sensor board is field-tested and ready for deployment ‘as is’ across a broad range of applications. It gives customers a direct path to scalable mass production – streamlined, efficient, and without the need for full custom camera development.” says Frederik Schönebeck, Director of Growth at FRAMOS.